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TSMC says future chip factories in the US will take two years or less to complete, a big step forward from the five years needed for its first Arizona plant. The goal is to narrow the technology gap with its cutting-edge Taiwanese fabs.
While the first US fab makes chips on a 4nm process, TSMC aims to start 3nm production in 2028 and reach 2nm 'before 2030.' This would bring American output closer to the most advanced nodes used in Taiwan.
For Apple, which relies heavily on TSMC, the move reduces geopolitical risks tied to China-Taiwan tensions. Critics, however, point out that all R&D remains in Taiwan, limiting the US's chances of true semiconductor leadership.
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