Resonac Holdings Corp., a prominent Japanese chip material maker, announced plans to establish a US-JOINT consortium alongside nine other Japanese and US firms. The initiative, headquartered in Silicon Valley, aims to advance semiconductor technologies crucial for generative AI and autonomous driving applications. The consortium will focus primarily on developing cutting-edge semiconductor packaging technologies, traditionally centred in Asia.

According to Resonac, the move to Silicon Valley will facilitate closer collaboration with major semiconductor device manufacturers, enhancing technology development and addressing technical challenges not fully covered by existing US consortiums. The facility is slated to be fully operational by next year, emphasising the consortium's commitment to accelerating innovation in semiconductor packaging.

Among the consortium's members are six Japanese companies, including Towa Corp. and Tokyo Ohka Kogyo Co., along with four US firms, such as Azimuth Industrial Co. and KLA Corp.

Why does this matter?

The establishment of US-JOINT reflects a broader trend in the semiconductor industry, where competition to develop state-of-the-art chips intensifies amid the rapid expansion of generative AI and data centres. The consortium's formation underscores international efforts to foster technological advancements for future digital innovations.