Qualcomm is reportedly developing the Snapdragon X2, a next-generation high-end processor for Windows PCs. Leaks suggest the new chip could feature up to 18 Oryon V3 cores, potentially boosting performance significantly.

The Snapdragon X2 is expected to adopt a system-in-package (SiP) design, integrating RAM and flash storage within the processor to enhance efficiency and data transfer speeds.

The processor is said to support configurations of up to 48GB of RAM and a 1TB SSD, according to leaked documents. While specific clock speeds remain unknown, it is described as a high-TDP variant, indicating a focus on raw power.

Qualcomm is also reportedly testing the chip with a liquid cooling system, suggesting efforts to manage heat output in high-performance environments.

Branding for the processor is expected under the 'Snapdragon X2 Ultra Premium' label, with a focus on competing against Intel, AMD, and Apple's M-series chips.

Qualcomm previously confirmed its next PC processor, the Snapdragon X Elite Gen 2, would include the Oryon V3 CPU, following the success of its predecessor, the Oryon V2.

The Snapdragon X2 could improve the Windows on ARM ecosystem, offering better efficiency and performance. However, software compatibility challenges remain a key concern, as ARM-based Windows devices have previously struggled with certain applications.

Official details from Qualcomm are still pending, with more information possibly emerging at industry events such as Mobile World Congress.